In the semiconductor industry, ensuring the reliability and performance of integrated circuits (ICs) and other electronic components is of utmost importance. The JEDEC JESD test standards provide a comprehensive set of guidelines for evaluating the ability of semiconductor devices to withstand various environmental and stress conditions, including thermal shock. Our Custom Two - Zone Thermal Shock Test Chamber is specifically engineered to meet the exacting requirements of the JEDEC JESD test standards. This advanced chamber offers a controlled and precise environment for subjecting semiconductor components to rapid temperature changes, enabling manufacturers, researchers, and quality control professionals to assess the durability and functionality of their products under realistic thermal stress scenarios.
At the core of this test chamber is its two - zone design, which enables highly accurate and independent temperature control. Zone 1 is calibrated to simulate cold environments, with a temperature range typically spanning from - 65°C to - 55°C, maintaining an exceptional accuracy of ± 0.1°C. This zone can replicate the frigid conditions that semiconductor components might encounter during storage in cold warehouses or operation in high - altitude, low - temperature environments. Zone 2 is dedicated to mimicking hot environments, covering a range from 125°C to 150°C, also with an accuracy of ± 0.1°C. This zone can represent the elevated temperatures experienced during semiconductor device operation, in thermal management systems, or during the soldering process. The precise temperature control in both zones ensures that semiconductor components are tested under the exact thermal conditions specified in the JEDEC JESD test standards, allowing for a detailed and accurate assessment of their performance.
One of the most critical features of this chamber is its ability to achieve ultra - rapid thermal transitions between the two zones. In a mere 1 - 2 seconds, the chamber can seamlessly switch from the cold conditions of Zone 1 to the hot conditions of Zone 2, and vice versa. This rapid transition time is in strict accordance with the requirements of the JEDEC JESD test standards for thermal shock testing. Semiconductor components in real - world applications often experience sudden and extreme temperature changes, such as when a device is powered on or off, or when it is exposed to rapid changes in ambient temperature. The short transition time of the chamber accurately replicates these abrupt temperature shifts, enabling the detection of potential failures in components due to thermal stress. These failures could include cracks in the semiconductor package, failures of solder joints, or degradation of electrical properties.
We recognize that different semiconductor components have unique thermal requirements based on their design, function, and intended use. Therefore, our chamber offers fully customizable test profiles that are fully compliant with the JEDEC JESD test standards. Manufacturers and testers can program specific temperature cycles, dwell times, and transition rates for each zone according to the specific test procedures outlined in the standards for different types of components. For example, a high - performance microprocessor may require a test profile that includes multiple rapid thermal transitions to simulate the actual usage conditions, while a more robust memory chip may need a profile that emphasizes long - term exposure to extreme temperatures. This flexibility in test profile customization ensures that each semiconductor component is tested under the most relevant and accurate thermal conditions as per the JEDEC JESD test standards, resulting in reliable and actionable test results.
The chamber is designed with a spacious interior to accommodate a wide variety of semiconductor components, from small integrated circuits and discrete semiconductors to large - scale multi - chip modules and printed circuit boards with multiple semiconductor devices. The standard chamber capacities range from 49 cubic meters to 1000 cubic meters, and can be customized to meet the specific requirements of larger or more complex component assemblies. This allows for the testing of multiple samples simultaneously or the evaluation of complete semiconductor systems, significantly improving testing efficiency and reducing costs. Whether it's testing a single microchip or a full - scale motherboard with multiple semiconductor components, the large chamber capacity provides the necessary space for comprehensive testing.
Built with high - quality materials and advanced engineering techniques, the thermal shock test chamber is designed to withstand the rigors of continuous use in a semiconductor testing environment. The exterior is constructed from a corrosion - resistant and heat - resistant alloy that can endure exposure to various chemicals, extreme temperatures, and potential physical impacts. The internal components, including heating, cooling, and control systems, are carefully selected and engineered for maximum durability and reliability. This robust construction ensures consistent test results over time and reduces the need for frequent maintenance, making it a reliable long - term investment for the semiconductor industry.
The chamber is equipped with a user - friendly interface that simplifies the testing process. The intuitive touch - screen control panel allows operators to easily set up test parameters for each zone, start and stop tests, and monitor real - time temperature data. The interface also provides access to historical test data, enabling users to analyze trends and make informed decisions about product design and quality improvement. Additionally, the chamber is equipped with comprehensive safety features, such as over - temperature protection, leakage protection, and emergency stop buttons, ensuring the safety of operators and the integrity of the testing equipment.
| Model | TSC-49-3 | TSC-80-3 | TSC-150-3 | TSC-216-3 | TSC-512-3 | TSC-1000-3 |
| Inside dimension(W x D x H) mm | 40 x 35 x 35 | 50 x 40 x 40 | 65x 50 x 50 | 60 x 60 x 60 | 80 x 80 x 80 | 100 x 100 x 100 |
| Outside dimension(W x D x H) mm | 128x 190 x 167 | 138 x 196 x 172 | 149 x 192 x 200 | 158 x 220 x 195 | 180 x 240 x 210 | 220 x 240x 220 |
| Internal material | #304 Stainless Steel |
| External material | Powder coated #304 Stainless Steel |
| High temperature range | 60 ℃ ~ 200 ℃ |
| Low temperature range | 0 ℃ ~ -70 ℃ |
| Test temperature range | 60 ℃ ~ 180 ℃ / 0 ℃ ~ -70 ℃ |
| Temperature recovery time | 1-5min |
| Temperature stability ℃ | ±2 |
| Cylinder switching time | 10s |
| High temperature ℃ | 150 | 150 | 150 | 150 | 150 | 150 |
| Heating time (min) | 20 | 30 | 30 | 30 | 30 | 30 |
| Low temperature | -40, -50, -65 | -40, -50, -65 | -40, -50, -65 | -40, -50, -65 | -40, -50, -65 | -40, -50, -65 |
| Cooling time (min) | 40, 50, 60 | 40, 50, 60 | 40, 50, 60 | 40, 50, 60 | 40, 50, 60 | 40, 50, 60 |
| Air circulation system | Mechanical convection system |
| Cooling system | Imported compressor, fin evaporator, gas condenser |
| Heating system | Fin heating system |
| Humidification system | Steam Generator |
| Humidification water supply | Reservoir, Sensor-controller solenoid valve, recovery-recycle system |
| Controller | Touch panel |
| Electrical power requirements | 3 phase 380V 50/60 Hz |
| Safety device | Circuit system load protection, compressor load protection, control system load protection, humidifier load protection, overtemperature load protection, fault warning light |
Subjecting semiconductor components to realistic thermal shock tests in our two - zone chamber that meets the JEDEC JESD test standards allows manufacturers and testers to identify and address potential weaknesses in design, material selection, and manufacturing processes. By exposing the components to the extreme temperature variations specified in the standards, they can detect issues such as thermal expansion mismatches, degradation of electrical properties, and failures of mechanical connections. This enables them to make necessary design modifications and manufacturing improvements, resulting in higher - quality semiconductor components that are more resistant to thermal stress and have a longer lifespan. Components that pass these rigorous tests are less likely to experience failures during their intended use, ensuring the reliability of electronic systems that rely on these components.
Early detection of component failures through thermal shock testing in line with the JEDEC JESD test standards can save semiconductor manufacturers significant costs. By identifying and resolving issues before mass production, companies can avoid expensive rework, production delays, and the potential for product recalls. The ability to test multiple samples simultaneously or conduct full - scale testing in the large - capacity chamber also reduces testing time and costs, improving the overall efficiency of the product development process.
Meeting the JEDEC JESD test standards is a mandatory requirement for semiconductor components to be accepted in the market. Our two - zone thermal shock test chamber is designed to help manufacturers ensure that their components comply with these important standards. By conducting comprehensive thermal shock tests in strict accordance with the standard's procedures, they can demonstrate compliance and gain market access more easily. This compliance is essential for maintaining the trust of customers and regulatory bodies in the semiconductor industry.
In the highly competitive semiconductor market, offering components that meet the JEDEC JESD test standards gives manufacturers a significant competitive edge. By using our custom two - zone thermal shock test chamber to conduct in - depth and comprehensive testing, companies can differentiate their products from competitors and showcase their commitment to quality and reliability. Customers are increasingly demanding semiconductor components that have been thoroughly tested and proven to perform well under extreme thermal conditions. By providing such components, manufacturers can attract more business, increase market share, and strengthen their position in the industry.
- High - Performance CPUs: Test high - performance central processing units (CPUs) to ensure their reliable operation under rapid temperature changes. These components are often used in high - end computing systems, and thermal shock testing can help identify potential issues with clock speed stability, data processing accuracy, and power consumption under extreme thermal conditions.
- Microcontrollers for Embedded Systems: Evaluate microcontrollers used in embedded systems, such as automotive engine control units, industrial automation systems, and consumer electronics. Thermal shock testing can help ensure their proper functioning under the thermal stress experienced in these applications.
- Dynamic Random - Access Memory (DRAM): Test DRAM modules to ensure their data retention and access speed are not affected by thermal shock. These components are crucial for the performance of computer systems, and thermal stress can lead to data corruption or system crashes.
- Flash Memory Chips: Evaluate flash memory chips used in solid - state drives (SSDs), USB drives, and memory cards. Thermal shock testing can help identify potential issues with write and read operations, endurance, and overall reliability under extreme temperature conditions.
- Wireless Communication ICs: Test wireless communication integrated circuits, such as Wi - Fi modules, Bluetooth chips, and cellular communication ICs. These components need to maintain their signal integrity and communication performance under thermal shock, as they are often used in mobile devices and wireless networks.
- Optical Communication ICs: Evaluate optical communication integrated circuits used in fiber - optic communication systems. Thermal shock testing can help ensure their proper functioning under the temperature variations experienced in these high - speed communication systems.
Our Custom Two - Zone Thermal Shock Test Chamber that meets the JEDEC JESD test standards is an essential tool for the semiconductor industry. With its advanced features, precise temperature control, rapid thermal transitions, and customizable test profiles, it provides a comprehensive and reliable platform for testing the performance and reliability of semiconductor components under extreme thermal conditions. Whether you are a semiconductor manufacturer looking to improve the quality of your products or a quality control professional aiming to ensure compliance with industry standards, our chamber is the ideal choice. If you are interested in learning more about our chamber or scheduling a demonstration, please contact us. Our team of experts is ready to assist you.
