In the precise and highly competitive field of Printed Circuit Board (PCB) manufacturing, ensuring the reliability and performance of PCBs under various environmental conditions is of utmost importance. Our Custom Thermal Shock Test Chamber is an advanced solution specifically designed to meet the unique testing needs of the PCB industry. This chamber can simulate extreme temperature changes, enabling manufacturers to identify potential issues, optimize product design, and ensure the reliable operation of PCBs in real - world applications.
Our thermal shock test chamber is equipped with a state - of - the - art temperature control system that allows for highly accurate temperature regulation. The temperature range can be adjusted over a wide spectrum, typically from - 55°C to + 150°C, with a temperature accuracy of ± 0.5°C. This precise temperature control ensures that each test is conducted under highly consistent and repeatable conditions, providing PCB manufacturers with reliable and accurate test results. Whether testing High - Density Interconnect (HDI) PCBs or traditional multi - layer PCBs, the precise temperature control enables manufacturers to precisely evaluate the performance of their products under different temperature environments.
One of the most remarkable features of the thermal shock test chamber is its ability to achieve rapid thermal transitions. It can switch from a high - temperature environment to a low - temperature one, and vice versa, in just a few seconds, simulating the sudden temperature changes that PCBs may encounter during actual use. For example, during transportation in different climatic conditions or while operating in environments with alternating high and low temperatures. The rapid thermal transition time, usually within 5 - 10 seconds, significantly reduces the overall testing time and improves the efficiency of the product development and quality control processes. This feature is crucial for detecting potential failures in PCBs caused by thermal stress, such as solder joint cracks, trace breaks, or material delamination.
We understand that different PCBs have unique testing requirements, depending on their design, materials, and intended applications. Therefore, our thermal shock test chamber offers fully customizable test profiles. Manufacturers can program specific temperature cycles, dwell times, and transition rates according to the specific PCB specifications and usage scenarios. For instance, PCBs used in the aerospace industry, which require high reliability, may need more stringent temperature cycles and longer dwell times to simulate the extreme space environment. On the other hand, PCBs for consumer electronics can have test profiles customized based on the temperature changes in daily use. The customizable test profiles ensure that each PCB is tested under the most relevant and realistic conditions.
The chamber features a spacious interior that can accommodate PCBs of various sizes and quantities. The standard chamber capacity ranges from 49 liters to 2000 liters, and can be customized to meet specific customer requirements. This allows manufacturers to test multiple PCB samples simultaneously or large - scale PCB assemblies, significantly improving testing efficiency and reducing costs. Whether it's small prototype PCBs or large - scale production PCBs, the large chamber capacity can meet different testing needs.
The thermal shock test chamber is equipped with an intuitive and user - friendly interface that simplifies the testing operation and monitoring process. The color touch - screen control panel enables operators to easily set test parameters, start and stop tests, and monitor real - time temperature data. The interface also provides storage and query functions for historical test data, facilitating users to analyze test trends and provide a strong basis for PCB design improvement and quality enhancement. In addition, the chamber is equipped with comprehensive safety protection features, such as over - temperature protection, leakage protection, and emergency stop buttons, ensuring the safety of operators and the normal operation of the testing equipment.
| Model | TSC-49-3 | TSC-80-3 | TSC-150-3 | TSC-216-3 | TSC-512-3 | TSC-1000-3 | | Inside dimension(W x D x H) mm | 40 x 35 x 35 | 50 x 40 x 40 | 65x 50 x 50 | 60 x 60 x 60 | 80 x 80 x 80 | 100 x 100 x 100 | | Outside dimension(W x D x H) mm | 128x 190 x 167 | 138 x 196 x 172 | 149 x 192 x 200 | 158 x 220 x 195 | 180 x 240 x 210 | 220 x 240x 220 | | Internal material | #304 Stainless Steel | | External material | Powder coated #304 Stainless Steel | | High temperature range | 60 ℃ ~ 200 ℃ | | Low temperature range | 0 ℃ ~ -70 ℃ | | Test temperature range | 60 ℃ ~ 180 ℃ / 0 ℃ ~ -70 ℃ | | Temperature recovery time | 1-5min | | Temperature stability ℃ | ±2 | | Cylinder switching time | 10s | | High temperature ℃ | 150 | 150 | 150 | 150 | 150 | 150 | | Heating time (min) | 20 | 30 | 30 | 30 | 30 | 30 | | Low temperature | -40, -50, -65 | -40, -50, -65 | -40, -50, -65 | -40, -50, -65 | -40, -50, -65 | -40, -50, -65 | | Cooling time (min) | 40, 50, 60 | 40, 50, 60 | 40, 50, 60 | 40, 50, 60 | 40, 50, 60 | 40, 50, 60 | | Air circulation system | Mechanical convection system | | Cooling system | Imported compressor, fin evaporator, gas condenser | | Heating system | Fin heating system | | Humidification system | Steam Generator | | Humidification water supply | Reservoir, Sensor-controller solenoid valve, recovery-recycle system | | Controller | Touch panel | | Electrical power requirements | 3 phase 380V 50/60 Hz | | Safety device | Circuit system load protection, compressor load protection, control system load protection, humidifier load protection, overtemperature load protection, fault warning light | |
By subjecting PCBs to thermal shock testing, manufacturers can identify potential design flaws and material issues in advance. When simulating the temperature changes in actual use environments, it is possible to detect the weak points of PCBs under thermal stress, such as the reliability of solder joints and the matching of material thermal expansion coefficients. By addressing these issues, manufacturers can significantly improve the reliability of PCBs, reduce the risk of failures during actual use, and thus enhance product quality and customer satisfaction.
Conducting thermal shock testing in the early stage of product development can help manufacturers identify and solve problems before mass production, avoiding costly recall costs, repair expenses, and customer complaints caused by product failures. At the same time, the rapid testing cycle and large chamber capacity can improve testing efficiency, reduce testing time and costs, optimize the entire product development process, and increase the economic benefits of the enterprise.
In the PCB industry, there are numerous international and domestic standards and specifications that set requirements for the reliability and performance of PCBs. Our thermal shock test chamber can assist manufacturers in ensuring that their products meet these standards, such as IPC - A - 610 (Acceptability of Electronic Assemblies) and J - STD - 020 (Moisture/Reflow Sensitivity Classification for Non - Hermetically Sealed Solid State Surface Mount Devices). Compliance with standards not only facilitates product market access but also enhances customer confidence in product quality.
In the highly competitive PCB market, providing high - quality and reliable products is the key for enterprises to stand out. By using our custom thermal shock test chamber for comprehensive testing, manufacturers can demonstrate their strict control over product quality to customers and prove the excellent performance of their products under extreme temperature conditions. This helps enterprises establish a good brand image, win customer trust and orders, and thus gain a competitive edge in the market.
- Consumer Electronics: Used to test PCBs in smartphones, tablets, laptops, and other consumer electronics to ensure their stability during daily use, such as when switching between different seasons or indoor and outdoor environments.
- Automotive Electronics: Conduct thermal shock testing on PCBs in automotive engine control units (ECUs), in - vehicle infotainment systems, sensors, etc., to ensure their ability to adapt to various harsh temperature conditions during vehicle operation and ensure driving safety.
- Industrial Control: Test PCBs used in industrial automation equipment, robots, power control systems, etc., to ensure their reliability in industrial production environments, capable of withstanding high and low temperatures and rapid temperature changes.
- Aerospace and Defense: Perform strict thermal shock testing on high - reliability PCBs used in the aerospace and defense industries, simulating the extreme temperature changes in the space environment or military combat environment to ensure that PCBs can still operate normally under these harsh conditions.
Our custom thermal shock test chamber is a high - performance testing device specifically designed for PCBs. It combines many advantages such as precise temperature control, rapid thermal transitions, customizable test profiles, large chamber capacity, and a user - friendly interface. It provides PCB manufacturers with a reliable and efficient testing method, which is conducive to improving product quality, reducing costs, meeting industry standards, and enhancing market competitiveness. If you are interested in our custom thermal shock test chamber, please feel free to contact us. Our professional team will be happy to provide you with detailed product information, personalized solutions, and excellent after - sales service. We look forward to working with you to create a brilliant future in the PCB industry!
